Official ANSYS Channel Partner in Ukraine
ANSYS Icepak –
electronics thermal
management simulation
ANSYS Icepak is the industry-standard thermal CFD tool for electronics cooling – from component junction temperature to server rack airflow. ECAD import (ODB++, IDF), electronics component libraries, and fan P-Q models make Icepak 3-5× faster to set up than generic CFD. Official licensing and English-speaking support in Ukraine.
Electronics-specific CFD built on ANSYS Fluent — the industry standard for thermal management
Direct ECAD import: ODB++ and IDF from Altium Designer, Cadence Allegro, Zuken
Component libraries: BGA, QFN, IGBT, SiC modules, fans with P-Q curves, TIM database
Coupled EM-thermal-structural: Maxwell → Icepak → Mechanical (solder fatigue, PCB warpage)
English-speaking electronics thermal team – CADFEM Ukraine, authorized ANSYS partner
#1
specialized electronics thermal CFD built on ANSYS Fluent — industry standard for PCB, power electronics, and server cooling
3–10×
faster model setup vs generic ANSYS Fluent for electronics cooling tasks thanks to ECAD import and component libraries
10+
years CADFEM Ukraine — authorized ANSYS Channel Partner with English-speaking electronics engineering team
Key Use Cases
What is ANSYS Icepak
Electronics thermal CFD — from chip to system level
ANSYS Icepak is a specialized CFD tool built on the ANSYS Fluent solver, configured specifically for electronics thermal management. While ANSYS Fluent is a universal CFD tool, Icepak adds what electronics engineers need: an extensive library of IC package models (BGA, QFN, QFP, TO-220), fan models with real P-Q curves, TIM material database, and direct ECAD import from Altium, Cadence, and Zuken.
CADFEM Ukraine — the sole authorized ANSYS Channel Partner in Ukraine — provides official Icepak licenses, English-language thermal training, simulation consulting for EV electronics, server infrastructure, 5G hardware, and defense avionics. We support international companies operating in Ukraine and Ukrainian electronics exporters requiring English-language deliverables.
Electronics-specific component libraries
Hundreds of ready-to-use models: BGA, QFN, QFP, IGBT modules, SiC devices, heat sinks, fans with P-Q curves, and TIM materials with real thermal resistance data. No need to build models from scratch.
ECAD import: ODB++ and IDF
Direct import of PCB layout data from Altium Designer, Cadence Allegro, and Zuken in ODB++ and IDF formats. Components are automatically placed on the board — engineers assign power dissipation values and run the analysis.
3–10× faster setup than generic CFD
Icepak's electronics-specific solver (Fluent-based) and automated hex-dominant meshing with component-aware refinement reduces model setup time dramatically compared to generic ANSYS Fluent for the same electronics cooling task.
Multi-level thermal hierarchy
From die-level (junction temperature Tj) to board-level (PCB thermal map) to system-level (server rack airflow) — Icepak supports hierarchical modeling with appropriate detail at each level in a single or linked analysis.
Industry Applications
Where ANSYS Icepak is applied
EV power electronics, servers, automotive ECU, PCBs, 5G base stations, and defense avionics — Icepak wherever electronics heat matters
EV Power Electronics: Inverters & OBC
Thermal management of IGBT and SiC traction inverter modules, on-board chargers (OBC), and DC-DC converters for electric vehicles — including liquid cold plate design.
IGBT/SiC module junction temperature prediction
DC-link capacitor thermal derating
Liquid cold plate channel design and optimization
Thermal cycling life prediction (coupled to Mechanical)
Server & Data Center Cooling
Airflow and thermal analysis of server chassis, blade systems, and rack configurations. Hot aisle / cold aisle layout optimization, liquid cooling validation.
Server processor and memory junction temperature
1U/2U server airflow: fan curve operating point
Rack-level hot spot identification
Direct liquid cooling: manifold and cold plate design
Automotive Electronics: ECU & ADAS
Thermal analysis of ECU modules in the engine bay (125°C ambient), ADAS radar and LiDAR units, BMS battery management systems, and in-cabin infotainment electronics.
ECU thermal derating at 125°C ambient
LiDAR and radar thermal management
BMS: cell temperature uniformity analysis
Passive cooling design for sealed IP67 enclosures
PCB Thermal Analysis
Board-level thermal simulation directly from ECAD data. Identify hot components, optimize copper pour layouts, validate heatsink selection, and assess via thermal resistance.
PCB thermal map from ODB++ / IDF import
Component power assignment from BOM
Via and copper layer thermal resistance
Heatsink selection and thermal interface material (TIM) optimization
5G Base Stations & RF Power Amplifiers
Thermal management of 5G mmWave Active Antenna Units (AAU): RF power amplifier (PA) thermal derating, passive heatsink design for IP65/IP68 enclosures, and ETSI climate class validation.
5G AAU: PA module thermal derating (28/39 GHz)
Passive cooling of sealed RF enclosures
ETSI ENV 300 019 climate class compliance
Thermal throttling margin prediction for mmWave PA
Aerospace & Defense Avionics
Thermal analysis of avionics in LRU enclosures — conduction cooling to VME/VPX chassis, altitude-derated convection analysis, and MIL-STD-810 thermal environment compliance.
Conduction-cooled VME/VPX card thermal analysis
Altitude-derated air cooling (12,000 m)
MIL-STD-810 hot/cold soak compliance
1 kW/liter power density thermal management
Key Technologies
ANSYS Icepak capabilities
Icepak combines the physics accuracy of ANSYS Fluent with electronics-specific tooling — making thermal analysis accessible to electronics engineers.
Solver
Fluent-based electronics solver
Optimized ANSYS Fluent solver with electronics-specific boundary conditions, automatic hex-dominant meshing, and component-aware mesh refinement.
TIM Database
Thermal interface materials
Built-in library of thermal interface materials: thermal paste, phase-change pads, gap fillers — with real λ (W/m·K) and Rjc data from manufacturer specifications.
Fan Models
P-Q fan curves
Fan models with real pressure-flow (P-Q) curves. Icepak automatically computes the fan operating point in the system — no manual iteration.
DELPHI models
IC thermal resistance
Two-resistance DELPHI models (Rjc + Rja) from JEDEC JESD51 datasheet data for rapid IC-level analysis without detailed internal package geometry.
ECAD link
ODB++ / IDF bidirectional
Import from Altium, Cadence, Zuken. Parametric update: when PCB layout changes, Icepak model updates automatically — no re-import.
Multiphysics
EM + thermal + structural
Maxwell Joule heating → Icepak thermal → Mechanical thermo-structural (solder fatigue, PCB warpage). Full ANSYS Workbench multiphysics chain.
Typical Icepak workflow: from ECAD to thermal report
1
ECAD Import
Load ODB++ or IDF from Altium/Cadence. Components auto-placed on board with footprint geometry and layer stackup.
2
Power Assignment
Assign power dissipation to each component from datasheet or from circuit simulation results (LTspice, Simplorer).
3
Boundary Conditions
Define cooling: forced air convection with fan P-Q curve, liquid cold plate, natural convection, radiation. Ambient temperature and pressure.
4
Solve & Report
Run thermal analysis. Output: junction temperatures (Tj), thermal maps on PCB, component-level Rja values, thermal resistance from junction to ambient.
Licensing & Procurement
ANSYS Icepak in Ukraine: license, price, packages
Where to buy
How to get an official ANSYS Icepak license in Ukraine?
CADFEM Ukraine is the sole authorized ANSYS Channel Partner in Ukraine. We provide official Icepak licenses with full technical support, English-speaking electronics thermal engineering team, training, and simulation consulting. Contact us for a commercial proposal.
Pricing
How much does ANSYS Icepak cost?
Pricing depends on license type (lease or perpetual) and configuration — Icepak standalone or as part of ANSYS Electronics Suite (Icepak + HFSS + Maxwell + Q3D + SIwave). Submit a request for an individual quote based on your thermal engineering requirements.
Icepak vs Fluent
Why use Icepak instead of ANSYS Fluent for electronics cooling?
Icepak is built on the Fluent solver but is specialized for electronics: ready component libraries (ICs, fans, heat sinks), direct ECAD import (ODB++, IDF), electronics-specific post-processing (junction temperature, Rja, DELPHI models). A Fluent generalist needs days to build what an Icepak engineer does in hours. For electronics cooling, Icepak is 3–5× faster to set up.
Thermomechanics
Can Icepak thermal results be used for solder fatigue analysis?
Yes. The standard ANSYS Workbench workflow: Icepak computes PCB temperature field under operating conditions → temperature loads transferred to ANSYS Mechanical → Mechanical computes thermal stress and strain in solder joints, copper traces, and PCB laminate under thermal cycling. This gives solder joint fatigue life per IPC-9701 — a critical analysis for automotive and industrial electronics qualification.
CADFEM Ukraine Services
Training, thermal consulting & installation
Training
Where to get ANSYS Icepak training in English in Ukraine?
CADFEM Ukraine conducts Icepak training in English and Ukrainian — classroom and online. Courses: Introduction to Icepak (ECAD import, component setup, fan models, post-processing), Advanced Icepak (liquid cooling, combined EM-thermal, solder fatigue workflow), and corporate training for automotive, aerospace, and telecom electronics teams.
Thermal Consulting
Does CADFEM Ukraine provide electronics thermal simulation on contract?
Yes. Our consulting team performs Icepak thermal analyses on contract: EV inverter thermal management, server cooling, PCB hot spot analysis, 5G AAU thermal derating, and avionics thermal compliance. Deliverables include thermal maps, component Tj values, cooling system recommendations, and English-language engineering reports.
Installation
How to set up ANSYS Icepak with ECAD tools in an enterprise environment?
Our engineers perform Icepak installation end-to-end: software setup, ECAD tool integration (Altium, Cadence ODB++, IDF export configuration), ANSYS Workbench multiphysics chain setup, and validation. English-speaking post-installation support included.
FAQ
Frequently asked questions about ANSYS Icepak
Technical, licensing, or thermal simulation questions — our English-speaking electronics engineering team responds within one business day.
+38 (050) 454-37-54What is ANSYS Icepak and how does it differ from ANSYS Fluent for electronics cooling?
+
ANSYS Icepak is a specialized electronics thermal CFD tool built on the ANSYS Fluent solver engine, but with an electronics-specific user interface, component libraries, and ECAD import capability. The key difference: Icepak provides hundreds of ready IC package models (BGA, QFN, QFP), fan P-Q curve models, TIM material database, and direct import from Altium/Cadence in ODB++ or IDF format. A generic Fluent model of the same PCB assembly would require weeks of manual geometry creation. Icepak reduces this to hours — making it the standard tool for electronics thermal engineers.
How does ECAD import work in ANSYS Icepak?
+
Icepak supports two ECAD formats: ODB++ — the complete PCB data format containing component placement, footprints, copper layers, drill data, and net connectivity (exported from Altium, Cadence Allegro, Mentor PADS, Zuken). IDF — Intermediate Data Format for 3D component body placement (height, footprint). The ODB++ import automatically places all components on the board and reconstructs the copper layer thermal conductivity map — dramatically reducing manual model setup. Engineers then assign power dissipation to components and run the analysis.
What is the thermal resistance Rjc and Rja and how does Icepak use them?
+
Rjc (Junction-to-Case thermal resistance) describes the thermal resistance from the semiconductor die to the component package bottom surface. Rja (Junction-to-Ambient) describes the resistance from die to ambient air. Both are standard datasheet parameters per JEDEC JESD51. Icepak uses these in the two-resistance DELPHI model — a fast, accurate representation of IC package thermal behavior without modeling internal package geometry. This allows rapid board-level thermal analysis with accurate junction temperature prediction for each component.
How does ANSYS Icepak model liquid cooling (cold plates)?
+
Icepak models liquid cooling via Cold Plate objects: user specifies inlet temperature, flow rate, coolant type (water, ethylene glycol, PAG oil for EV inverters), and channel geometry. For a simplified analysis: Icepak applies the cold plate as a boundary condition with an effective thermal resistance. For a detailed analysis: channels can be fully 3D-resolved using Fluent CFD internally. This covers EV inverter liquid cooling, server liquid cooling manifolds, and liquid-cooled RF power amplifier assemblies.
How does Icepak connect to ANSYS Mechanical for solder fatigue and PCB warpage?
+
In ANSYS Workbench: Step 1 — Icepak computes steady-state or transient thermal fields on the PCB under operating conditions. Step 2 — temperature results are mapped as thermal loads to ANSYS Mechanical. Step 3 — Mechanical computes thermal stress and strain in solder joints (BGA, QFN), copper traces, and PCB laminate. Step 4 — solder fatigue life is estimated per IPC-9701 using Coffin-Manson or Engelmaier models. PCB warpage (Z-deformation) is also computed. This coupled workflow is the industry standard for automotive and industrial electronics reliability qualification.
Does CADFEM Ukraine provide Icepak support in English for electronics companies?
+
Yes. CADFEM Ukraine provides all Icepak services in English: license procurement, technical support, thermal simulation consulting (EV electronics, servers, 5G, avionics), and training. Our electronics thermal engineering team supports international companies operating in Ukraine, Ukrainian electronics manufacturers targeting export markets, and engineering teams requiring thermal analysis reports in English for international customers or certification bodies.
Get ANSYS Icepak in Ukraine
Official ANSYS Icepak license from CADFEM Ukraine
Sole authorized ANSYS Channel Partner in Ukraine. Official licenses, English-speaking electronics thermal engineering support, Icepak training, and simulation consulting for EV, server, 5G, and defense electronics companies.
Request a commercial proposal
We respond within one business day · No obligation